| 摘要 |
PURPOSE:To inspect whether bonding is performed properly or not during the bonding operation and improve operation efficiency by detecting the waveform of a high frequency current flowing through a capillary. CONSTITUTION:Inspection of bonding is carried out based upon a waveform of a high frequency current applied during the bonding process. The current intensity of the high frequency current outputted by an ultrasonic oscillator 15 is subjected to analog/digital conversion by an A/D converter 18 and memorized in a memory 21. The current intensity is added by an adder 22 and supplied to a judging circuit 29. The output of a divider 23, obtained by dividing the added current intensity, is supplied to a normalizing circuit 24 and a normalized pattern is formed. The difference between the normalized pattern and a pattern obtained when the proper bonding is performed and memorized in a memory 25 is detected by a differential detection circuit 26. A correlative value obtained by adding the output of the differential detection circuit 26 in an adder 27 is supplied to the judging circuit 29. The judging circuit 29 judges that the proper bonding is performed if the correlative value is not more than the predetermined value and the value added by the adder 22 is within the predetermined range. |
