| 发明名称 |
Method for Brazing interconnect pins to metallic pads. |
| 摘要 |
<p>A method for use in brazing an interconnect pin to a portion of metallization pattern (e.g. a pad) existing on a brittle dielectric substrate, such as a multi-layered ceramic (MLC) substrate, is disclosed.</p> |
| 申请公布号 |
EP0198354(A2) |
申请公布日期 |
1986.10.22 |
| 申请号 |
EP19860104601 |
申请日期 |
1986.04.04 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CHURCHWELL, ROBERT WILLIAM;FLAITZ, PHILIP LEE;HUMENIK, JAMES NOEL |
| 分类号 |
H01L23/50;H01L21/48;H01R12/04;H05K3/34 |
主分类号 |
H01L23/50 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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