摘要 |
A method of packaging solid members having rigid projections, e.g., electrical connectors, on a flexible foam substrate assembly. The method generally includes disposing a portion of the substrate at a workstation and causing the solid member to move toward the substrate so that the projections penetrate the substrate to removably mount said solid member therein. This procedure is repeated as different portions of the substrate are presented to the workstation until a desired number of solid members have been mounted on the substrate. The substrate can then be reeled or arranged in such a manner to be mounted within a suitable container for future removal of the solid members from the substrate.
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