发明名称 Method of manufacturing semiconductor device having a pressure sensor
摘要 The present invention relates to a semiconductor device having a semiconductor pressure sensor, which includes a heavily-doped semiconductor layer having a predetermined impurity concentration gradient and formed at the bottom of a diaphragm (membrane portion). Owing to the presence of this semiconductor layer, a flat diaphragm is formed, and a semiconductor pressure sensor of high precision is provided.
申请公布号 US4618397(A) 申请公布日期 1986.10.21
申请号 US19850802431 申请日期 1985.11.27
申请人 HITACHI, LTD. 发明人 SHIMIZU, ISAO;YAMADA, KAZUJI
分类号 G01L9/00;H01L29/84;(IPC1-7):H01L21/306;B44C1/22;C03C15/00;C03C25/06 主分类号 G01L9/00
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