| 摘要 |
PURPOSE:To improve the reliability by attenuating any power supply noise in mother chip by a method wherein both pellet and condenser are mounted on the mother chips. CONSTITUTION:Almost round holes 13 corresponding to the electrode shape of a pellet are made in an electrode forming part corresponding to an electrode of pellet 3 while elliptic holes 14 corresponding to the electrode shape of a chip condenser 5 are made in another electrode forming part corresponding to an electrode 5a of chip condenser 5. Firstly three layered pad electrodes 15, 25 corresponding to the hole shapes 13, 14 are formed on each exposed parts of a wiring 7 while solder bumps 4, 6 are formed on each pad electrodes. Secondly the solder bumps 4 and the solder bumps 6 are respectively mounted with a pellet 3 and a chip condenser 5 while the solder bumps 4, 6 are heated by heater such as infrared ray lamp etc. to be melted and then cooled down and solidified. Resultantly the pellet 3 and the chip condenser 5 can be solidified on the mother chip 2. |
