发明名称 SEMICONDUCTOR COMPONENT EMBEDDED IN A COMPOUND-FILLED CUP
摘要 <p>In a compound-filled cup is fitted a semiconductor body provided with junction members on both sides. The semiconductor body has a control line which is coupled with a connection contact. The connection contact is attached on the cup wall and has a section protruding into the space between the inner side of the cup wall and the semiconductor body, which section is electrically connected with the control line.</p>
申请公布号 CA1213078(A) 申请公布日期 1986.10.21
申请号 CA19840453684 申请日期 1984.05.07
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 VOGT, HERBERT;EGERBACHER, WERNER;WUNDERLICH, DIETER;MITZKUS, WERNER
分类号 H01L23/04;H01L21/60;H01L23/051;H01L23/49;(IPC1-7):H01L23/28 主分类号 H01L23/04
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