发明名称 APPARATUS FOR BONDING MINUTE PARTS
摘要 PURPOSE:To obtain an adhesive layer having a uniform thickness and, at the same time, to position minute parts with high precision, by applying an adhesive with the medium of slits equipped with a mask on a bonding table, pressing minute parts against the table and cooling the adhesive after heating. CONSTITUTION:A turning lever 31 is moved by turning around an axis 30 to separate it from a mask 20. A heat source 43 is moved upward to abut a heat conductor 39 against a heating plate 12. A heater 40 is operated to heat a work bonding table 16. An adhesive is applied on the bonding table 16 and melted. A mask 20 is put on the bonding table 16 and positioned and fixed with a fixing shaft 28. Works 22 are put in slits 21 of the mask 20, positioned and fixed with a first micrometer head 37 of the turning lever 31 and pressurized with pins 35 to bond works 22 to the bonding table 16. Only the mask 20 is elevated and clamped. The heater 40 is cooled to cure the adhesive.
申请公布号 JPS61235480(A) 申请公布日期 1986.10.20
申请号 JP19850076975 申请日期 1985.04.11
申请人 SANYO ELECTRIC CO LTD 发明人 NAKAGAWA TERUO;ONISHI TOSHIO
分类号 C09J5/00;B23P21/00;G11B5/127 主分类号 C09J5/00
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