| 摘要 |
PURPOSE:To obtain the title resin which can give a thick-film product without forming crazings, voids and pinholes, by reacting a specified aromatic tetracarboxylic acid dianhydride with an aromatic diamine in an organic solvent and heating the product. CONSTITUTION:A polyimide precursor solution is obtained by reacting 1mol of an aromatic tetracarboxylic acid dianhydride component comprising 2,3,4,4a,4b,5,6,7-octahydrophenanthrene-3,4,5,6-tetracarb-ox-ylic dianhydride and 50-0wt% other aromatic tetracarboxylic acid anhydride (e.g., pyromellitic dianhydride) with 0.7-1.5mol of an aromatic diamine (e.g., 4,4'-diaminodiphenyl ether) at 0-80 deg.C in an organic solvent (e.g., N,N-dimethylacetamide). This solution is heated for 1-10hr at a temperature which finally reaches 200 deg.C or higher to obtain the title resin.
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