| 摘要 |
PURPOSE:To hold the level of a melted plating metal incorporated in the melting vessel of the plating metal to a specified position by providing a level sensor to the melting vessel of the plating metal in the plating device of melted metal and melting the ingot of the plating metal in the position of the surface of the melted metal detected with the sensor. CONSTITUTION:The molten 5 of the melted plating metal such as Sn incorporated in the melting vessel 7 of metal is fed to the inside of a hot dipping vessel 1 and a wire 2 to be plated such as a copper wire is passed and Sn is plated on the surface. In such a case, the oxidation of the melted Sn is prevented by making the melting vessel of Sn a closed type and making the inside thereof the inert gas atmosphere. Also two pieces of level sensor 9, 10 different in the tip positions are provided and the surface level of the melted Sn incorporated in the vessel 7 is detected and the descent of a melted metal surface of the melted Sn 5 is sensed with the sensor 9 and a heater 11 melting an ingot 6 is electrically conducted. When the surface of the melted metal is ascended by the melting of the Sn ingot, it is detected with the sensor 10 and the electric conduction of the heater 11 for melting the Sn ingot 6 is stopped.
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