| 摘要 |
PURPOSE:To readily form a lead frame without using an expensive manufacturing method such as etching even in case of the frame with many fingers by forming the frame with the fingers fundamentally by an electroforming. CONSTITUTION:A resist layer 9 of the desired pattern is formed on a substrate 8, and the shape of a nonresist portion 8a is formed in a lead frame shape of the desired pattern. A metal layer 10 is formed only on the nonresist portion 8a except the layer 9 by electroforming on the substrate 8, and pressed to bend to project at the metal layer side. Then, the layer 10 of a laminate is again electroformed, the second metal layer 11 is laminated, and a contact material 12 is further coated on the end 4d of the finger 4. When only the substrate 8 is eventually separated from the laminate, a lead frame 7 having the finger 4 is obtained. The end 4d of the obtained finger 4 is formed with a bump 4a having a thickness in the projecting direction, and suitable flexibility is applied by a thin erected portion 4c. |
