| 摘要 |
PURPOSE:To alleviate the adverse effects on a parasitic element remarkably, by providing a double structure of the outer surface part of a stud and the inner conductor part of the stud for a heat radiating stud. CONSTITUTION:Signal conductor patterns 1103 are arranged in radial straight line conductor patterns with respect to a main body 1102 of a package. The patterns are formed so that the signal propagating times of all the conductor patterns become equal. The width of the wiring path in the signal conductor pattern between A and B is made smaller continuously. The thickness of a dielectric substrate of a package main body 2102 is made thin in this section. Therefore, the characteristic impedance of the wiring path is kept at a constant value. A heat radiating stud 2111 has a double structure of an outer surface part 2109 of the stud, which is electrically conducted to a grounding conductor pattern 2101, and an inner conductor 2110 of the stud, which is electrically insulated from the grounding conductor pattern 2101 but conducted to a chip mounting part 2105. Thus, the effect of a parasitic element is remarkably decreased, and high frequency grounding can be sufficiently performed. |
