| 摘要 |
PURPOSE:To obtain stable discharge, by providing a mechanism, which guides the upper part of a semiconductor product on the top force of a cutting mold. CONSTITUTION:On a punch 1 of a cutting mold, a guide 6, which guides the upper part of a semiconductor product, and a driving part 7, which drives the guide 6, are provided. Before the semiconductor product 4 is discharged by a pusher 5, the guide 6 is lowered by the driving part 7 and arranged on the upper part of the semiconductor product 4. The semiconductor product is guided by the guide 6 when the product is discharged. Based on the accuracy of the outside of the mold, clearance between the semiconductor product 4 and the guide 6 is determined. Since the semiconductor product is guided when it is discharged, erroneous operation in the discharging can be prevented. The stroke of the pusher, which pushes the semiconductor product, is not required to be long. The stable feeding of the semiconductor can be performed without lowering the strength of the pusher.
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