| 摘要 |
PURPOSE:The titled composition, obtained by using a resin prepared by incorporating an epoxy resin having a low viscosity at a low temperature with a specific phenoxy resin while heating, having both improved heat and thermal shock resistance and prevented settling of a filler and useful for cast insulators. CONSTITUTION:An epoxy resin composition obtained by incorporating (A) an epoxy resin prepared by incorporating 100pts.wt. epoxy resin having <=200 epoxy equivalent, e.g. bisphenol A type epoxy resin, with 0.5-10pts.wt. phenoxy resin expressed by the formula (n is about 100) while heating, with (B) a harden er and (C) an inorganic filler, preferably alumina powder, usually at 20-80 deg.C, preferably under reduced pressure. Preferably, the component (B) to be used is a condensation mixture of 100pts.wt. polybasic carboxylic acid anhydride, e.g. hexahydrophthalic anhydride, with 40-60pts.wt. bisphenol A.
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