| 摘要 |
PURPOSE:To provide the titled composition having excellent workability, heat- resistance, adhesivity, electrical characteristics, etc., and suitable for a molded article for printed circuit board having low dielectric constant and low loss tangent, by compounding a cyanate resin composition with a specific copolymer of butadiene and an aromatic vinyl compound. CONSTITUTION:The objective composition can be produced by compounding (A) a resin composition composed of a polyfynctional cyanic acid ester having >=2 cyanato groups in one molecule and represented by the formula R(OCN)m(m is 2-5; R is aromatic organic group) and/or its prepolymer and/or a prepolymer of the cyanic acid ester and an amine, and if necessary, other thermosetting resin with (B) a copolymer having a melting point of >=10 deg.C and obtained by (1) copolymerizing butadiene and an aromatic vinyl compound to obtain a copolymer wherein >=50% of the butadiene unit constituting the polymer chain is 1,2-bond butadine and (2) introducing >=0.5 one or more kinds of functional groups such as hydroxyl group, carboxyl group, etc., per one molecule on an average. The ratio of A/B is 95/5-40/60. |
