发明名称 EPOXY RESIN MOLDING MATERIAL FOR SEALING
摘要 PURPOSE:To provide a molding material containing a reaction product of an epoxy resin and a polybutadiene polymer, having improved crack resistance and excellent moldability and free of mold staining and stick in the mold. CONSTITUTION:The objective material contains a reaction product of an epoxy resin and a polybutadiene polymer. A polyfunctional novolak epoxy resin is used as the epoxy resin and 100pts.wt. of the resin is compounded with 0.5-50 pts.wt. of a polybutadiene polymer.
申请公布号 JPS61233051(A) 申请公布日期 1986.10.17
申请号 JP19850074698 申请日期 1985.04.09
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 TORII MUNETOMO;OKABE HIDEKI;IKEDA KOJI
分类号 C08G59/00;C08G59/14;C08G59/18;C08L7/00;C08L21/00;C08L63/00 主分类号 C08G59/00
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