发明名称 |
EPOXY RESIN MOLDING MATERIAL FOR SEALING |
摘要 |
PURPOSE:To provide a molding material containing a reaction product of an epoxy resin and a polybutadiene polymer, having improved crack resistance and excellent moldability and free of mold staining and stick in the mold. CONSTITUTION:The objective material contains a reaction product of an epoxy resin and a polybutadiene polymer. A polyfunctional novolak epoxy resin is used as the epoxy resin and 100pts.wt. of the resin is compounded with 0.5-50 pts.wt. of a polybutadiene polymer.
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申请公布号 |
JPS61233051(A) |
申请公布日期 |
1986.10.17 |
申请号 |
JP19850074698 |
申请日期 |
1985.04.09 |
申请人 |
MATSUSHITA ELECTRIC WORKS LTD |
发明人 |
TORII MUNETOMO;OKABE HIDEKI;IKEDA KOJI |
分类号 |
C08G59/00;C08G59/14;C08G59/18;C08L7/00;C08L21/00;C08L63/00 |
主分类号 |
C08G59/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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