发明名称 FORMATION OF WIRE BONDING BALL
摘要 PURPOSE:To assure the bonding property of a ball and the neck strength by a method wherein a metallic wire as minus and a discharge electrode as plus are impressed with high voltage in inert gas atmosphere, setting up the discharge current at that time to be low-level current in the former time and high-level current in the latter time. CONSTITUTION:A metallic wire 1 as minus and a discharge electrode 2 as plus are impressed with high voltage in inert gas atmosphere to start arcing 3, setting up the discharge current to be low level current 11. Resultantly, the arcing 3 reaches the upper part of wire 1 for surface cleaning only not to melt the wire at all. When the set up time t1 elapsed and the oxide film on the surface of wire 1 is removed to start arcing 3 between the end of wire 1 and the discharge electrode 2, the discharge current is set up to be high-level current 12. At this time, the end part 6 of wire 1 is concentratedly heated so that a melted part 28 keeping spherical form may be formed into a ball 28 most of which is completely melted when the set up time t2 elapsed leaving a bit of unmelted part on the neck part 28a.
申请公布号 JPS61231726(A) 申请公布日期 1986.10.16
申请号 JP19850073025 申请日期 1985.04.05
申请人 MITSUBISHI ELECTRIC CORP 发明人 HIROTA SANEYASU;MACHIDA KAZUMICHI
分类号 H01L21/60 主分类号 H01L21/60
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