| 摘要 |
PURPOSE:To prevent the generation of warping based on a temperature change, to obviate the damage of a semiconductor chip and to improve yield on manufacture by ending the peripheral section of a die stage consisting of a plate-shaped member to a flange shape. CONSTITUTION:A strip material in copper, etc. is punched and molded in the same manner as a lead frame is machined normally, the peripheral sections 21 of a die stage 2 are bent downward to a flange shape, and the die stage 2 is formed to a box shape as a whole, thus reinforcing strength against bending. The process is enabled easily by a forming press. A semiconductor chip 1 is fixed onto the die stage 2, the peripheral sections 21 of which are bent to the flange shape and which is reinforced, by silver paste, et. Accordingly, since the die stage 2 is reinforced, the die stage 2 is difficult to deformed to the temperature changes of the melting temperature of 150-200 deg.C of silver paste and the normal temperature, thus improving yield on manufacture. |
