| 摘要 |
PURPOSE:To improve the bonding property of the metal wire to the lead by a method wherein, before the wire-bonding process, by pressing body provided with the spherical pressing surface on its point is pressed to the bonding areas of the lead and the pressing body is made to spin. CONSTITUTION:Before the wire-bonding process, the spherical pressing surface 8a of a pressing bar 8 is pressed to the bonding areas of a lead 6 with the prescribed load and the pressing bar 8 is made to spin within a time of 1sec or less, for example, in the pressed state. Whereupon the oxide film on the surface of the lead 6 is destroyed by the spinning of the pressing bar 8 and the destroyed oxide film 6a is extruded on the side of the outer periphery of the pressing surface 8a, that is, toward outside of the bonding areas of the lead 6. As the bonding areas of the lead 6 are cleaned in such a way, the spinning and pressing of the pressing bar 8 are stopped thereafter and after the pressing bar 8 is made to shift upward, a wire-bonding is performed using a metal wire 7 in the same way as the conventional one. As a result, the bonding property of the metal wire 7 to the lead 6 can be significantly improved. |
