| 摘要 |
Photoresist formulations for forming relief structures from highly heat-resistant polyimide polymers containing in each case, in an organic solvent, essentially at least a) a polyamide-ester prepolymer carrying photopolymerisable radicals, b) a radiation-reactive copolymerisable unsaturated compound, c) a photosensitiser, d) a photoinitiator and e) a leuco dye, show an increased light sensitivity if they contain as photoinitiator a compound of the type of the N-azidosulphonylarylmaleimides and, as leuco dye, a compound of the type of the triarylmethanes.
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