发明名称 SEALING RESIN COMPOSITION
摘要 PURPOSE:The titled composition low in stress and excellent in moisture resistance, laser markability, moldability, etc., comprising an epoxy resin, a novolak phenolic resin, a specified organic dye, an ethylene/vinyl alcohol copolymer and an inorganic filler. CONSTITUTION:An epoxy resin (A) having at least two epoxy groups in the molecule, such as an epoxy novolak resin of formula I (wherein R<1> is R<2> or a halogen, R<2> is H or an alkyl and n>=1) is melt-kneaded with a novolak phenolic (modified) resin (B) in an amount to provide a molar ratio of the epoxy groups in component A to the phenolic OH groups in component B of 0.1-10, 0.01-10wt% organic dye (C) having at least one metal atom or ion in the molecule, such as a compound of formula II, III or IV, 0.1-20wt% ethylene/vinyl alcohol copolymer (D) having a group of formula V (wherein m>=1) in the molecule, 25-90wt% inorganic filler (E) each as silica powder and, optionally, a mold release, flame retardant, colorant, silane coupling agent, etc., (F).
申请公布号 JPS61231023(A) 申请公布日期 1986.10.15
申请号 JP19850070799 申请日期 1985.04.05
申请人 TOSHIBA CHEM CORP 发明人 HOSOKAWA HIROYUKI;SAWAI KAZUHIRO
分类号 C08G59/00;C08G59/18;C08G59/62;C08K5/00;C08L63/00;H01L23/29;H01L23/31 主分类号 C08G59/00
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