发明名称 HOT STAMPING METHOD
摘要 PURPOSE:To enable the transfer of a desired pattern with good adhesiveness so as to form a recessed part, by forming an org. film showing good thermal adhesiveness to a hot stamping foil and a metal plating film to at least a part of the metal plating film and transferring the hot stamping foil to said org. film. CONSTITUTION:A metal plating film 2 is formed to a plastic molded product 1 by electroless Ni-plating and succeeding electroplating and an acrylic clear paint is applied to said film 2 to form an org. film 3. A hot stamping foil having the same constitution as a hot stamping foil 14 is placed on said film 2 and a stamp made of high speed steel is heated to be pressed to the molded article from the hot stamping foil side. By this method, the org. film 3 is fused to the adhesive layer of the hot stamping foil to be perfectly closely adhered thereto. The org. film 3 has effect lowering heat conductively and the desired pattern by the stamp is certainly formed to the plastic molded product 1. This pattern 4 comprising the hot stamping foil 14 successively consisting of a release layer 10, a top coat layer 11, a colored pigment layer 12 and the adhesive layer 13 fused to the org. film 3 from above and is formed as a recessed part 5 because of heating and stamping by the stamp.
申请公布号 JPS61230980(A) 申请公布日期 1986.10.15
申请号 JP19850073218 申请日期 1985.04.06
申请人 SONY CORP 发明人 WATANABE YOSHIO;FUEKI SHIMETOMO
分类号 B41M5/00;B41M5/382 主分类号 B41M5/00
代理机构 代理人
主权项
地址