| 摘要 |
PURPOSE:To remove effectively low-MW components from a solid epoxy resin to thereby obtain an epoxy resin which, especially when used in a laminate, can give a laminate improved in processability, coatability, soldering-heat resistance, etc., by contacting the solid epoxy resin with a hydrocarbon solvent. CONSTITUTION:A high-MW solid epoxy resin of an epoxy equivalent of about 300-2,000 is prepared by, for example, reacting a low-MW epoxy resin with a polyphenol (e.g., bisphenol A) in the presence of a catalyst (e.g., sodium hydroxide). This solid epoxy resin is contacted with a hydrocarbon solvent (e.g., toluene or hexane) at a temperature of about 50-200 deg.C to remove low-MW components from the resin. The obtained epoxy resin can be suitably used as a laminating resin in the field of, especially, materials for electric devices and appliances.
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