| 摘要 |
PURPOSE:To eliminate thermal stress generated by volume change or grinding frictional heat on the basis of grinding resistance or property change in grinding by fine setting the sinking speed of a diamond grinding wheel continuous by and steplessly by the continuous down-feed method. CONSTITUTION:A wafer is attracted to six chucks 9 set by six-divided frame of a rotary table 8. The rotary table 8 rotates intermittently at a slow speed at 1/6 turn steps. In the chuck position 9b, a diamond grinding wheel fixed to a cup wheel 11 at the bottom of a rotating spindle 10 sinks from above automatically to start course grinding. In the chuck positions 9c and 9d, prefinish and finish grindings are performed, respectively. These grinding in chuck position 9b, 9c, 9d are made by the continuous down-feed system at 0.01mum-0.3mm/ min.
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