Electroless plating apparatus

摘要

An apparatus for use in electroless plating wherein the activity of the plating solution is controlled by regulating the oxygen content of the plating solution. The apparatus includes an outer container in which the stabilized, oxygen-rich plating solution is stored. An oxygen sparger is located in the outer container to introduce a predetermined amount of oxygen into the plating solution to stabilize it. A flux container and plating vessel are located inside the outer container and define a separate flux zone and a separate plating zone, respectively, through which the plating solution is passed. A nitrogen sparger is located within the flux container to purge all or some oxygen from the stabilized plating solution to provide an active plating solution. The active plating solution is passed from the flux container into the plating vessel where plating of the substrate takes place. Active plating solution continually flows from the plating vessel back to the oxygen-rich reservoir for oxygenation and storage prior to recycling back through the flux container and plating vessel.