| 摘要 |
PURPOSE:To improve percentage defectives on manufacture, to enhance efficiency on manufacture and to prevent an effect on an active element of the physical stress of a sensor section by mounting an electric circuit formed to a second silicon chip and a connecting means connecting a detecting element and the electric circuit. CONSTITUTION:A semiconductor sensor consists of a first silicon chip 2, on one main surface thereof a detecting element 3 is shaped, and a second silicon chip 6 joined with the other main surface of the first silicon chip through a joining film. In the semiconductor sensor, terminals 9 fitted onto the silicon chip 2 in order to extract a resistance value from the semiconductor strain gage 3 and terminals 10 for connecting an output from the semiconductor strain gage 3 to an active element 4 formed onto the silicon substrate 6 are conducted by metallic wires 11. The active element 4 is shaped onto the residual substrate with which the silicon chip 2 is not joined in the silicon substrate 6. Accordingly, a sensor section and the active element are each shaped onto several silicon substrate, thus reducing the percentage defectives of the active element, then preventing an operation to the active element of physical stress by the sensor section.
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