| 摘要 |
PURPOSE:To prevent a short circuit between a metal and an IC chip by shaping a lead frame to a plane form by a first mold and sinking a die pad section to a horizontal form by a second mold. CONSTITUTION:When a lead frame 1 is transferred up to the position of a plane shaping mold 5, a die pad 1a, a hanging section 1b and leads 1c in the lead frame 1 are shaped previously to a plane form by a top force 5a and a bottom force 5b. When sections shaped to the plane form in the lead frame 1 are transported to the position of a mold 2, the die pad 1a is sunk to a horizontal form by a top force 2a and a bottom face 2b. The next die pad 1a section is positioned at the position of the mold 5 at that time, and the next die pad section is shaped to the plane form. Accordingly, a short circuit between a metal and an IC chip can be prevented positively. |
