发明名称 MOLD FOR MOLDING RESIN
摘要 PURPOSE:To trap void, going to flow into a cavity for product, perfectly by a method wherein a slit, provided with air suction ports, is connected to the gate of the mold for molding resin, whose runner for introducing the liquid resin is communicated with the cavity for product through the gate. CONSTITUTION:A lead frame 10 is provided on a bottom force 1B and a top force 1A is clamped to the bottom force 1B to form the cavity 5 for product. When air is sucked through the air suction port 7 and the slit 6, the liquid resin 11 in a pot 2 flows into the cavity 5 through the runner 3 and the gate 4 while the void 12 in the resin 11 flows also into the gate 4. The void 12 in the gate 4 arrives at a narrow section 4a, communicating with the slit 6, while the slit 6 is held in an evapuated condition, therefore, the void 12 is sucked and is discharged through the slit 6 and the air suction port 7. Accordingly, the liquid resin 11, including no void at all, is filled into the cavity 5.
申请公布号 JPS61229518(A) 申请公布日期 1986.10.13
申请号 JP19850070890 申请日期 1985.04.05
申请人 HITACHI LTD 发明人 SAEKI JUNICHI;SHINODA TADAO;KANEDA AIZO
分类号 H01L21/56;B29C33/10;B29C45/34;B29K105/20;B29L31/34 主分类号 H01L21/56
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