| 摘要 |
PURPOSE:To perform rapid and certain sealing, by forming a sealer comprising a synthetic resin having a heat deforming temp. lower than that of a circuit base member into a recessed shape and mounting said sealer on said base member so as to provide a gap between a circuit element and the base member before heating the same. CONSTITUTION:Circuit elements such as an IC chip 1, a resistor piece 4 and a condenser chip 5 etc. are adhered and fixed to a circuit substrate 8 being a circuit base member through lead plates 2, 6, 7 and seal members 10, 11, 12 each preformed into a recessed shape are inserted in the recessed parts of the substrate 8 so as to cover the circuit elements. The members 10, 11, 12 are formed by molding a material having heat deforming temp. lower than that of a circuit case and having characteristic change start temp. lower than that of each circuit element. Next, the whole is heated to proper temp. to thermally deform only the members 10, 11, 12 and to further melt the same. By this method, rapid and certain sealing can be performed. |
