| 摘要 |
PURPOSE:To measure the central position of the semiconductor element by a method wherein positional relation of a memory cell part to the semiconductor element is detected previously, and the demanded position is computed from the detected position of the memory cell and known positional relation. CONSTITUTION:The chip 2 is imaged by a camera 5 at first, the image signal thereof converted into binary signals are indicated on a monitor 10, and carsors 16, 17 are made to coincide with the easily recognizable four sides of the memory cell 3, and the positions of the carsors are detected 11 to be stored 13 through a control system 12. Then the chip image not converted into binary signals is indicated 10 to define the circumferential edge of the chip, the carsors 16, 17 are made to coincide with the four sides of the chip, and the positions of the carsors are stored 13 the same to complete preparation. Then the memory cell 3 is imaged, the image signal is converted 11 into binary signals, comparison is performed according to a previously set slice level to detect the memory cell 3, the coordinates are detected to perform computation 14, the memory 13 is read according to indication 11, and correction is computed 14 using the positional informations of two groups to compute the center of the chip. A tool 7 transferred 8 to the center of the chip according to the correcting quantity, and resin is dropt. |
