发明名称 Thermal etching of a compound semiconductor.
摘要 <p>A process for thermally etching a CaAs substrate prior to molecular beam epitaxy comprises the steps of: heating the GaAs substrate to above 750 DEG C.- at which temperature both Ga and As are evaporated from the GaAs substrate- whilst irradiating it with an As molecular beam, thereby removing contamination adhering to the surface of the GaAs substrate. As the substrate evaporates it carries with it the contamination. The process can be performed by an apparatus comprising a prechamber (2), in which the surface is evaporated, connected to a growth chamber (6), in which an epitaxial layer is grown.</p>
申请公布号 EP0196897(A1) 申请公布日期 1986.10.08
申请号 EP19860302355 申请日期 1986.03.27
申请人 FUJITSU LIMITED 发明人 SAITO, JUNJI
分类号 H01L29/812;C30B23/02;H01L21/20;H01L21/203;H01L21/263;H01L21/324;H01L21/338;H01L29/80;(IPC1-7):H01L21/324;H01L21/302 主分类号 H01L29/812
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