| 摘要 |
PURPOSE:To obtain a small-sized sensor device, cost thereof is low and which has high sensitivity, by wire-bonding an element and a lead frame which exposing a sensor section and burying and sealing a wire by an insulating material. CONSTITUTION:An element 12 has four magnetic sensitive sections 14a-14d and four bonding pads 15a-15d corresponding to these magnetic sensitive sections 14a-14d, and the element 12 and leads 13a-13d are buried and sealed by an insulating material 16 under the state in which the element 12 is joined onto one lead 13b in the magnetic sensor device 11. The bonding pads 15a-15d and the leads 13a-13d are bonded by four wires 17a-17d in projecting sections 16a consisting of the insulating material 16, and the wires 17a-17d are protected and insulated by the insulating material 16. A hole section 16b reaching the lead 13b is formed to the insulating material 16 on the back side in the magnetic sensor device 11. Accordingly, the element and the sensor device are miniaturized, and the sensor device can be assembled automatically, thus reducing cost. |
