RESIN ENCAPSULATION TYPE SEMICONDUCTOR DEVICE BY USE OF EPOXY RESIN COMPOSITION

摘要

There is disclosed a resin encapsulation type semiconductor device having a semiconductor element and a resinous encapsulating material for encapsulating said semiconductor element therein, said resinous encapsulating material comprising a cured product of an epoxy resin composition for encapsulation of semiconductor, comprising:… (a) 100 parts by weight of an epoxy resin;… (b) 5 to 500 parts by weight of a curing agent having at least two phenolic hydroxyl groups in one molecule;… (c) 0.01 to 20 parts by weight of an organic phosphine compound; and… (d) 0.1 to 100 parts by weight of at least one antimony oxide selected from the group consisting of diantimony tetroxide, hexaantimony tridecaoxide and diantimony pentoxide. …The resin encapsulation type semiconductor device according to the present invention has high reliability in thermal cycle resistance, humidity resistance and the like.