Substrate structure for a semiconductor device.

摘要

A substrate structure comprising a ceramic tile (1), a conductor layer (2) of copper or copper alloy directly joined to the surface of the ceramic tile (1), and an output terminal (4) connected to the conductor layer (2). The part of the conductor layer (1) to which the output terminal (4) is joined is raised from the ceramic tile (1) so as to bridge an empty space (6).