| 摘要 |
PURPOSE:To maintain preferable soldering wettability even after leads are formed by treating with CRC rustproof coating agent from above plating or dipping treatment, thereby preventing a corrosion from a fine crack. CONSTITUTION:A semiconductor pellet 1 is mounted on a bed of a lead frame 3, the prescribed wire bonding 2 is performed, and the prescribed region is sealed with resin molding layer 4. Then, the metal surface of electrode leads 5 exposed from the layer 4 is plated or coated with solder or tin film by dipping. Electrode leads 5 coated with the solder or tin film on the surfaces are formed in the shape for mounting on a flat surface. Then, the entire body including the layer 4 is dipped in 1.5-3% isopropyl alcohol of rustproof coating agent, and then thermally dried. |
