Method for the soldering of semiconductor chips on supports of not-noble metal

摘要

After the support of not-noble metal has suitably been heated and before and during the application of a tablet of soldering material destined to receive the semiconductor chip, the soldering area is engaged by a reducing gas flame (for example, 20% hydrogen and 80% nitrogen at a temperature lower than 570 DEG C.), which eliminates any oxidation products. The soldering is thus of very good quality without using the normal plating of noble metal.