| 摘要 |
PURPOSE:To protect a semiconductor element from a large distortion caused by an external disturbance and obtain a thin and solid structure by housing the semiconductor element within the thickness of a wiring board. CONSTITUTION:A semiconductor element 4 with bumps 5 is housed almost in wiring boards 1 and 2. Whole surroundings of the semiconductor element 4 with bumps 5 are filled with molding material 6. This filling material serves as reinforcement for the semiconductor substrate part. In this case, the molding material should not come out of the wiring conductors on the substrate side of the semiconductor element. With this mounting structure, even if an external distortion is applied, it is absorbed by the wiring board and does not affect direct influence upon the semiconductor element. |
