| 发明名称 |
Printed circuit boards having improved adhesion between solder mask and metal |
| 摘要 |
A printed circuit board having improved adhesion between solder mask and metal includes a primer film on the metal deposited from an aqueous solution which includes 0.01 to 10% by weight of a carboxyl-containing polymer or copolymer.
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| 申请公布号 |
US4615950(A) |
申请公布日期 |
1986.10.07 |
| 申请号 |
US19850712308 |
申请日期 |
1985.03.15 |
| 申请人 |
M&T CHEMICALS INC. |
发明人 |
HUNG, PAUL L. K.;RADIGAN, RICHARD J.;ROSEN, DAVID S. |
| 分类号 |
C09J5/00;B23K35/22;C09J5/02;H05K3/28;(IPC1-7):B32B15/08 |
主分类号 |
C09J5/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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