发明名称 SEMICONDUCTOR RECTIFIER
摘要 PURPOSE:To eliminate the crack and exfoliation of an adhesive at bonding portion by forming a projection on one of bonding surfaces of the portions of the first and second cases and a grooved recess to be inserted with the projection on the other of the bonding surfaces. CONSTITUTION:A projection 8d is formed on the lower end of the second case 8 in the bonded portion of the first case 6 and the second case 8, and a grooved recess 6a to be inserted with the entire projection 8d is formed on the upper end of the first case 6. The sides 8e, 8f and 6e, 6c of the projection 8d and the recess 6a are substantially vertical, and the surfaces 8g, 8h disposed at both sides of the root of the projection 8d are substantially horizontal. Accordingly, since a stress to separate the case 8 from the case 6 becomes extremely small, there is almost no possibility of crack of the bonded portion of the cases 6, 8 and of an exfoliation of an adhesive 7.
申请公布号 JPS61225847(A) 申请公布日期 1986.10.07
申请号 JP19850065030 申请日期 1985.03.30
申请人 TOSHIBA CORP 发明人 SUGITA NAOMASA;MORIGUCHI KOJI
分类号 H01L25/07;H01L23/02;H01L23/10 主分类号 H01L25/07
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