| 摘要 |
PURPOSE:To remove a curing pattern in a short time by forming a resist film in two layers and forming the curing pattern to the resist film of each layer so that the 1st conductor pattern is wider than a desired conductor pattern and applying metallic vapor-deposition. CONSTITUTION:The resist film 7 is formed on a piezoelectric substrate 5 and the curing pattern 7' is formed to the resist film 7 by using a mask 8 having a wider pattern than the desired conductor pattern. Then a resist film 9 is formed on the resist film 7 formed with the curing pattern 7' and a curing pattern 9' is formed on the resist film 9 by using a mask 10 having a pattern having a nearly equal width to that of the desired conductor pattern. Thus, uncured part is removed by using a solvent to the resist films 7, 9 formed with the curing pattern in two layers in this way. Then an Al thin film 11 is vapor- deposited to form the conductor pattern 6 on the piezoelectric substrate 5.
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