| 摘要 |
PURPOSE:To obtain copper base alloy having good conductivity and furthermore superior strength and spring property, by suppressing Ti content to min. limit, and adding Sn and Ni to ppt. intermetallic compd. CONSTITUTION:The titled alloy is composed of, by weight, 1.0-3.0% Ti, 1.0-5.0% Sn, 0.01-1.0% Ni and or Co and the balance Cu. By adding furthermore 0.01-1.0% of >=one kind among Al, In, Te as auxiliary component instead of a part of copper in the alloy, resistances for creep and corrosion are improved. The alloy has conductivity almost comparable with berrylium copper alloy or more, further exhibits superior strength, spring property, creep resistance, plating adhesive property, brazing property and corrosion resistance. Consequently, the alloy has superior feature as high class precise spring material substituting expensive berrylium copper alloy including poisonous problem.
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