| 摘要 |
PURPOSE:To realize a proper manufacture of semiconductor device, by preventing parts, supplied inside recessed parts of both jigs, from leaving the recessed parts with a centrifugal force, and by piling up both jigs so as not to generate foreign matters such as metal scraps. CONSTITUTION:Sleeves, leads, and pellets are inserted into the recessed part 7 of the first jig 5, and on the other hand, leads are inserted into the recessed part 8 of the second jig 6. The first and second jigs, 5 and 6, into which parts are completed to be supplied, are located and placed on a jig holding member 12, and then a turntable 10 is rotated. When the jig holding member 12 is raised during rotating the turntable 10, with a centrifugal force acting on the parts housed in the recessed parts 7 and 8 of respective jigs 5 and 6, the parts are prevented from leaving the recessed parts. Next, each jig holding member 12 is closed during rotating the turntable 10 and then the turntable 10 is stopped. When the first and second jigs 5 and 6 are taken off from the jig holding member 12, with them remaining fitted, and turning the second jig 6 above the first jig 5, the leads 1 inside the recessed part 8 of the second jig 6 are inserted, with their own wt., inside the corresponding recessed part 7 of the first jig 5.
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