| 摘要 |
PURPOSE:To improve the shock and vibration resistance of a crystal oscillation chip by using a lead terminal as a metallic spring as a supporter supporting directly the crystal oscillation chip. CONSTITUTION:One end of the metallic spring 11 supporting the crystal oscillation chip 15 is bonded to a semiconductor element 10 constituting an oscillation circuit by a metallic fine wire 13 and formed incorporatedly by a transfer mold member 14. The oscillation circuit formed by the transfer mold member 14 is bonded and fixed to a stem 19 made of a metal or the like being a base by an adhesives 18. A length offering the elasticity is given to the metallic spring 11 as the supporter of the crystal oscillation chip 15 and the metallic spring 11 acts like a buffer member.
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