| 摘要 |
PURPOSE:To prevent cracks yielded in an alumina ceramic frame in an element assembling processes, by providing an assembly, in which the contact width of a metallic base table and the frame and the thickness of the frame are specified. CONSTITUTION:To the upper surface of a metallic table 101 comprising 15wt% copper and 85wt% tungsten, an inner side 11a of the lower surface of an alumina ceramic frame 1 is bonded. In a recess part, which is formed on the upper surface of the frame 1, a package, to which a lead terminal 105 is bonded, is provided. A width W1 of a bonded part between the package and the metallic table 101 in the alumina ceramic frame 1 in such a semiconductor device does not exceed 0.6mm within a range airtight bonding can be performed. A thickness t1 of the first frame 1 at the lower part of the recess is made to be at least 0.8mm. Thus, yield of poor airtightness due to cracks in the ceramic frame during the element assembling processes can be prevented, and the highly reliable semiconductor device having a relatively large package can be obtained at a high yield rate. |
