| 摘要 |
PURPOSE:The titled composition excellent in heat shock resistance and moisture resistance and low in radiation of alpha rays, comprising an epoxy resin, a phenolic resin curing agent, a cure accelerator, an inorganic filler and a specified surface treating agent. CONSTITUTION:An epoxy resin (A) is melt-kneaded with a phenolic resin curing agent (B) (e.g., phenol novolak resin), a cure accelerator (C) (e.g., imidazole), 50-80vol% inorganic filler (D) comprising spherical silica powder of a particle size <=100 mesh, having a content of U and Th <=0.5ppb and a surface treating agent (E) comprising 0.1-1.5wt%, based on component D, purified water/epoxy silane mixture (9:1-9.95:0.05 by weight).
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