| 摘要 |
PURPOSE:To prevent electrolytic corrosion and migration on laminated board and improve insulating and adhesive properties and moisture and heat resistance of adhesive, by using an adhesive of a specified composition prepared by adding a hardener and additives to a high-purity epoxy resin. CONSTITUTION:The adhesive is prepard by blending 100pts.wt. high-purity epoxy resin, 1-100pts.wt. hardener consisting of at least one of a reaction product of an aromatic diamine and a quaternary phosphonium salt, a reaction product of phenol and imidazole and a reaction product of epoxy resin and imidazole, 5-200pts.wt. solvent, 0.01-10pts.wt. additive, 0.5-200pts.wt. inorganic filler and 5-100pts.wt. flame retarder. The high-purity epoxy resin is a compd. having at least two epoxy groups in the molecule and pref. containing 10ppm or lower free Na ion and Cl ion.
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