Semiconductor module cooling structure.

摘要

A semiconductor module cooling structure comprises a housing (33) having a passage (45, 46) through which a cooling fluid flows; a cooling block (72,75) to which the cooling fluid is supplied from the housing and which has an electrical insulating layer (36, 59) at the bottom portion and is combined with a semiconductor chip (40) through the electrical insulating layer; and a bellows (34) which is connected between the housing and the cooling block. The cooling fluid is supplied to the cooling block through the bellows. The bellows is formed in a manner such that a plurality of substantially plane ring-like metal plates (4) are laminated, pressed, diffused, joined, and thereafter stretched and molded.