发明名称 |
DISCRETE THIN FILM CAPACITOR |
摘要 |
<p>A decoupling capacitor for mounting on an integrated circuit multi-layer ceramic. A bottom layer electrode, is evaporated or sputtered onto a carrier. A high dielectric layer is deposited followed by the upper metallurgy and a top isolating layer. Via holes are etched to respective electrode layers, BLM deposited thereon followed by solder balls. The electrode is mounted onto the substrate, solder balls face down in contact with a compatible footprint.</p> |
申请公布号 |
EP0070380(B1) |
申请公布日期 |
1986.10.01 |
申请号 |
EP19820104815 |
申请日期 |
1982.06.02 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
DOUGHERTY, WILLIAM E.;FEINBERG, IRVING;HUMENIK, JAMES N.;PLATT, ALAN |
分类号 |
H01L27/04;H01G2/06;H01G4/06;H01G4/10;H01G4/12;H01G4/228;H01G4/30;H01L21/822;H01L21/8242;H01L27/10;H01L27/108;(IPC1-7):H01G4/30;H01G1/14;H01G1/035 |
主分类号 |
H01L27/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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