| 摘要 |
PURPOSE:To peel off a protective tape from the surface of all the wafers without fault, by returning a wafer which is detected to have a protective tape still after the process of peeling the tape so the residual tape is again peeled off. CONSTITUTION:The present device is for peeling off a protective tape 1 from the surface of each semiconductor wafer 2 by means of a pressure-sensitive tape 6. When a detection sensor 19 detects that a protective tape 1 has not been completely peeled off, the sensor 19 sends a detection signal to actuate a return belt means 17 and a stopper 18. Supply of new wafers is stopped on the supply side, while the wafer 2 in problem is inhibited by the stopper 18 from being sent to another station and is returned to the supply side by the return belt 17 to that the residual protective tape is again peeled off in a similar manner. |
