| 摘要 |
PURPOSE:To increase the number of wafers to be processed by moving a magazine in the same direction as that of moving a wafer transport arm in the stacking direction, so that the interval between the wafers is reduced, with the arm out of contact with the stored wafer. CONSTITUTION:A transport arm 3 is moved (a) from a fixed position to the right so that a wafer holding portion 3a takes a wafer W, and further moved (a) to the right to position just above a placing position for wafers W. Subsequently, the arm 3 is moved (b) downward to place the wafer W on a wafer processing device A, and then moved in the opposite direction to be returned to its fixed position. After the completion of processing the wafer W, the arm 3 is moved in directions of the arrows (a), (b) to take the processed wafer W, returned reversely to place the wafer W at its initial position in a magazine Ma, and returned to the fixed position. When an arm moving device 4 forces the arm 3 to move (b), a placing table moving device 2a forces a placing table 1 to move for the same travel (d) as that of the arm in the same direction in response to a signal from the moving device 4. Accordingly, the interval between wafers is reduced to increase the number of wafers to be stored.
|
