发明名称 FORMING METHOD FOR SILICON OXIDE FILM
摘要 PURPOSE:To improve film characteristics by plasma containing hydrogen gas in stock gas when decomposing stock gas by a glow discharge under reduced pressure with the stock gas containing silane gas to form a silicon oxide film. CONSTITUTION:An accumulated material 4 to become a primary base is placed on a lower electrode plate 3, and heated by a heater 5 while controlling it. Stock gas 6 is supplied from a bomb for silane gas diluted with hydrogen gas and a bomb for laughing gas through a flow rate regulator to a reaction furnace 1, and injected in a shower state from an injection hole formed at an upper electrode 2. Power is supplied from a high frequency power source 7 to generate a high frequency glow discharge between the electrodes 2 and 3 to form the stock gas in a plasma state, and a silicon oxide film is accumulated on the material 4. The stock gas employs silane gas SiH4 diluted to 1% with hydrogen gas H2 and laughing gas N2O.
申请公布号 JPS61218135(A) 申请公布日期 1986.09.27
申请号 JP19850059322 申请日期 1985.03.23
申请人 OKI ELECTRIC IND CO LTD 发明人 MASAKI YUICHI;IWABUCHI TOSHIYUKI;YOSHIDA MAMORU;UCHIYAMA AKIRA
分类号 H01L21/31;H01L21/316;(IPC1-7):H01L21/316 主分类号 H01L21/31
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